What's the consensus on terminals with integrated heat shrink insolation?
The TE Connectivity AMP PIDG seem to be the standard. Double crimp giving proper strain relief. However, seems like the heat string with sealing glue would be stronger that a second crimp and add the benefit of water-proofing (not that corrosion is and issue with properly sized, tined wire).
Curious, more than anything, if there's a better product out there.
The TE Connectivity AMP PIDG seem to be the standard. Double crimp giving proper strain relief. However, seems like the heat string with sealing glue would be stronger that a second crimp and add the benefit of water-proofing (not that corrosion is and issue with properly sized, tined wire).
Curious, more than anything, if there's a better product out there.