I know I may be entering the minefield here, but since I am getting ready to add ring terminals and Fast-On QD terminals in many locations, what is the consensus?
Crimping only: No stress concentration due to solder but a chance of wire coming loose if not crimped correctly (I suppose this means getting the proper crimper so every crimp is the same and tight)
Crimping and soldering: Said stress concentration could lead to fatigue failure at the interface of solder and no solder (unless supported well) but the chance of wire coming loose is nil.
OK, let me have it!
Crimping only: No stress concentration due to solder but a chance of wire coming loose if not crimped correctly (I suppose this means getting the proper crimper so every crimp is the same and tight)
Crimping and soldering: Said stress concentration could lead to fatigue failure at the interface of solder and no solder (unless supported well) but the chance of wire coming loose is nil.
OK, let me have it!