True...
Thank You Steve! Very succint, very true,and much shorter than they way I was thinking of posting a similar thought....
...but if you are going to use a specific technique, the NASA standards do show how to use it to a high standard, with good/bad examples and numbers.
For example, how many builders here know that for a 20g or smaller crimp on a D-sub pin (this thread...
..) that there should be between 0.010 and 0.030 of bare wire exposed at the entry to the pin?
If you do not have this dimension, then structural issues could occur by building crimp joints out of their original design spec.
A lot of the specs in the NASA document are for "piece items", and yes they are called out for by the system drawings, but they also exist as individual techniques.
There may be discussion on crimp vs solder, but both have been used in many high stress aerospace situations.
When I started in aerospace, crimp pins in military connectors did not even exist, and yet interconnections managed to get made.
Crimp and solder cup are both acceptable techniques, and that is why military (aka high stress) connectors are still made in both versions.
Whichever version you use, assemble it per the manufacturer's instructions, or for more generic parts, the NASA documents show "good" techniques.
Don't knock well made solder joints, they made it to the moon and Mars on my designs, and the vibration spectrum of a rocket launch (Saturn/Titan) easily out vibrates our Lycomings....